3DIC 2023: The IEEE International Conference on 3D System Integration

So much has changed since the first 3DIC conference in 2010!  3D integrated circuits have moved from academic curiosity to solid commercial reality.  The underlying technologies continually improve and evolve, incorporating new methods and resources.  Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates.  This 2023 conference will focus on the research and science of 3DICs.  It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

The call for papers is available for download here:  3DIC Call for Papers

The deadline for submission has now passed. 

Those who have submitted a paper and have been successful will receive their acceptance notification by Monday 6 March 2023. Accepted authors will have the option to submit a full length paper if they need the paper included in the conference proceedings. The last date for the submission of the full paper and slides is April 28th 2023.

A Best Paper Award will be presented to authors whose work represents groundbreaking research.

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