Speakers And Abstracts
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The Emergence of 2.5 D and 3D Glass Packaging, Manufacturing and Products
Founding Director and Emeritus Professor, Georgia Tech USA
Low Barrier Access to System Integration Prototyping Services through EUROPRACTICE
Strategic Development Director, IMEC
Photonic Systems-in-Packages based on thin glass – pSiP
Senior Scientist, Fraunhofer Institute for Reliability and Microintegration IZM, Berlin
Advanced Packaging Goes to Market
Founder – FaBrick AI, President – Nhanced Semiconductors Inc.
Advanced Interconnects for Chiplets
Product Manager Hybrid Bonding, Besi Netherlands B.V.
Performance Enablement through VIPack FOPOP for Mobile and Networking
Sr. Director Engineering and Technical Marketing ASE
3D Integration for Quantum Computing
Scientist, QuTech, Delft, Nethlands
Micro-Transfer Printing – An Advanced Assembly Technology for Heterogeneous Integration
Senior Program Manager, X-Celeprint Ltd